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Laser Marking of Semiconductors 

Fast and Precise Laser Marking within the Production Line

 
テキスト The cutting in two dimensions is a domain of the CO2 laser. Typical cutting speeds for mild steel are for example at 18m/min for 1 mm, 4.5 m/min for 3 mm and 1.5 m/min for 8 mm material strength. Basically, the cutting of metals with lasers happens through the local heating of the material above its melting point in the focal point of the focused laser. The resulting molten material is ejected by a gas flow oriented coaxially to the laser beam so that a kerf is formed.
 
 

Marking Mold Compounds

1Semicon_Mold_Compound.jpg テキスト Mild steel is the most frequently cut material in the industry. Thus e.g. gears, blinds, coverings or chain links of mild steel are cut using lasers.
 

Minimal Heat Input and Perfect Repeatability

2Semicon_Heat_Input.jpg テキスト In combination with fiber optic (solid-state laser) or mirror systems (CO2 lasers) also complex, three-dimensional mild steel components can be cut such as hydroformed parts for the automotive industry.
 

Water Marking

3Semicon_Water_Marking.jpg テキスト In combination with fiber optic (solid-state laser) or mirror systems (CO2 lasers) also complex, three-dimensional mild steel components can be cut such as hydroformed parts for the automotive industry.
 

Marking of Ceramics

4Semicon_Ceramics.jpg テキスト In combination with fiber optic (solid-state laser) or mirror systems (CO2 lasers) also complex, three-dimensional mild steel components can be cut such as hydroformed parts for the automotive industry.
 
             Features at a Glance

・ Fast (> 1000 characters/second)

・ Precisely controlled material penetration depths

・ Suitable for room manufacturing

 
 

Product recommendation

For this application we recommend the laser markers: PowerLine F 20 IC.